Two piece transaction card having fabric inlay

ABSTRACT

Disclosed embodiments generally relate to a transaction card with a fabric inlay. The transaction card may include a housing component having a first housing surface opposite a second housing surface and an inlay component having a first inlay surface opposite a second inlay surface. The inlay and housing may be joined along the second inlay surface and the first housing surface. In addition, the first inlay surface may include a fabric material and a backer layer configured to support the fabric material of the first inlay surface.

CROSS-REFERENCE TO RELATED APPLICATIONS

This application claims priority to U.S. Provisional Application No.62/436,809, filed Dec. 20, 2016, the contents of which are incorporatedherein by reference.

TECHNICAL FIELD

The disclosed embodiments generally relate to transaction cardconstructions. More particularly, and without limitation, the disclosedembodiments relate to a two-piece transaction card having a fabricinlay.

BACKGROUND

Transaction cards, such as credit and debit cards, have become a primarymeans for individuals to complete transactions involving data exchange.Traditional transaction cards are formed of plastic material as a singlepiece. For example, a typical credit card may be manufactured out of PVCplastic using an injection molding process. The plastic card may then bemodified to add functional and/or visual features. For example, amagnetic strip may be affixed to one side, the card may be stamped withthe card number and customer name, and color or a design may be addedfor appearance.

Some transaction cards may also include advanced data storage componentsattached to or embedded within the card. For example, some transactioncards may include microchips (e.g., EMV chips) that more securely andefficiently manage card and customer information and/or near fieldcommunication (NFC) components that can wirelessly communicate withoutside devices (e.g., a point of sale device, mobile device, etc.).While these types of technology provide several advantages to customers,the conventional, one-piece transaction card and associated methods ofconstruction may not be ideal and could likely benefit significantlyfrom improvements.

In addition, as transaction cards increase in prevalence, expectationsfor transaction card quality have increased. Transaction cards haveincreasingly been made to meet higher standards regarding materials,durability, security, and appearance. Further, traditional cardmanufacturing methods, which have employed limited card constructiontechniques and materials, continue to utilize techniques and materialsthat restrict variations in card style and appearance. For example, cardusers may desire a customizable card, or a card having particularfeatures, such as a desired appearance, texture, weight, material type,etc.

The present disclosure is directed to improvements in transaction cardsand methods of manufacture thereof.

SUMMARY

The disclosed embodiments relate to a transaction card and aprocess/method for constructing the card, wherein the card includes afabric inlay.

It is to be understood that both the foregoing general description andthe following detailed description are exemplary and explanatory onlyand are not restrictive of the disclosed embodiments, as claimed.

Consistent with disclosed embodiments, a transaction card may comprise ahousing component having a first housing surface opposite a secondhousing surface; and an inlay component having a first inlay surfaceopposite a second inlay surface, the inlay and housing being joinedalong the second inlay surface and the first housing surface, the firstinlay surface comprising: a fabric material; and a backer layerconfigured to support the fabric material of the first inlay surface.

Consistent with disclosed embodiments, a method of manufacturing atransaction card may comprise forming a housing component having a firsthousing surface opposite a second housing surface; forming an inlaycomponent having a first inlay surface opposite a second inlay surface,the inlay component comprising a backer layer configured to support afabric layer; applying a fabric material to the backer layer to form thefirst inlay surface; and joining the housing component and the inlaycomponent via the second inlay surface and the first housing surface.

BRIEF DESCRIPTION OF THE DRAWINGS

The accompanying drawings, which are incorporated in and constitute apart of this specification, illustrate disclosed embodiments and,together with the description, serve to explain the disclosedembodiments.

FIG. 1 is a block diagram of an exemplary transaction system, consistentwith disclosed embodiments.

FIG. 2 is an exploded-view illustration of an exemplary transactioncard, consistent with disclosed embodiments.

FIG. 3A is a top view of an exemplary transaction card consistent withdisclosed embodiments.

FIG. 3B is a bottom view of the exemplary transaction card of FIG. 3A.

FIG. 4A is a top view of an exemplary transaction card consistent withdisclosed embodiments.

FIG. 4B is a bottom view of the exemplary transaction card of FIG. 4A.

FIG. 4C is a cross-sectional view of the exemplary transaction card ofFIG. 4A taken along the line 4C-4C.

FIG. 5A is a top view of an exemplary transaction card consistent withdisclosed embodiments.

FIG. 5B is a bottom view of the exemplary transaction card of FIG. 5A.

FIG. 5C is a cross-sectional view of the exemplary transaction card ofFIG. 5A taken along line 5C-5C.

FIG. 6 is a top view of an exemplary transaction card consistent withdisclosed embodiments.

FIG. 6B is a bottom view of the exemplary transaction card of FIG. 6A.

FIG. 6C is a cross-sectional view of the exemplary transaction card ofFIG. 6A taken along line 6C-6C.

FIG. 7 is a cross-sectional view of an exemplary inlay componentconsistent with disclosed embodiments.

FIG. 8 is a cross-sectional view of an exemplary inlay componentconsistent with disclosed embodiments.

FIG. 9 is a cross-sectional view of an exemplary inlay componentconsistent with disclosed embodiments.

FIG. 10 is a flow chart of an exemplary method/process of manufacturinga transaction card consistent with disclosed embodiments.

FIGS. 11A-11C show steps of manufacturing an exemplary transaction cardconsistent with disclosed embodiments.

FIG. 12 is a flow chart of exemplary method/process steps of forming aninlay component consistent with disclosed embodiments.

FIGS. 13A-13C show steps of forming an exemplary inlay componentconsistent with disclosed embodiments.

DETAILED DESCRIPTION

Reference will now be made in detail to the disclosed embodiments,examples of which are illustrated in the accompanying drawings. Whereverconvenient, the same reference numbers will be used throughout thedrawings to refer to the same or like parts.

Disclosed embodiments include a two-piece transaction card with aninlay. The inlay may comprise a fabric material, or it may resemble afabric or fabric-like material. Disclosed embodiments further include atwo-piece transaction card having two separate card components that maybe connectable to form the transaction card. In some embodiments, thetwo card components, when connected, may define a space for receiving atleast one data storage component. Various methods may be used tomanufacture the separate card components out of different types ofmaterials that are suitable for satisfying certain criteria orpreferences. In addition, the construction of the separate componentsmay allow for ease of assembly, as well as interchangeability of thecomponents.

The term “transaction card,” as used herein, may refer to a physicalcard product that is provided with features to receive, store, and/ortransmit transaction information. As used herein, the term “personalinformation” may include information that is associated with a user ofthe card or information associated with an account of/for the card user.For example, personal information may include “transaction information,”such as financial information (e.g., card numbers, account numbers,expiration dates etc.), quasi-financial information (e.g., rewardsbalance, discount information, etc.), individual-identifying information(e.g., name, address, etc.), bank information, and/or transactionnetwork information. Examples of transaction cards may include creditcards, debit cards, gift cards, rewards cards, frequent flyer cards,merchant-specific cards, discount cards, identification cards,membership cards, and driver's licenses, but are not limited thereto.

The physical properties of the transaction card (e.g., size,flexibility, location of various components included in the card) maymeet various international standards, including, for example, ISO/IEC7810, ISO/IEC 7811, ISO/IEC 7812, ISO/IEC 7813, ISO/IEC 7816, ISO 8583,ISO/IEC 4909, and ISO/IEC 14443. For example, a transaction card mayhave a dimension of 85.60 mm (width) by 53.98 mm (height) by 0.76 mm(thickness), as specified in ISO/IEC 7810.

FIG. 1 illustrates an exemplary transaction system 10. Transactionsystem 10 may be a computing system configured to receive and sendinformation between the components of transaction system 10 and/or withcomponents outside of system 10. Transaction system 10 may include afinancial service provider system 12 and a merchant system 14, which maybe connected by a network 16. It should be understood, however, thattransaction system 10 may include additional and/or alternativecomponents.

Financial service provider system 12 may be one or more computer systemsassociated with an entity that provides financial services. For example,the entity may be a bank, credit union, credit card issuer, or othertype of financial service entity that generates, provides, manages,and/or maintains financial service accounts for one or more customers.Financial service accounts may include, for example, credit cardaccounts, checking accounts, savings accounts, loan accounts, rewardaccounts, and any other types of financial service account. Financialservice accounts may be associated with physical financial servicetransaction cards, such as a credit or debit cards that a user may carryon their person and use to perform financial service transactions, suchas purchasing goods and/or services at a point of sale (POS) terminal.Financial service accounts may also be associated with electronicfinancial products and services, such as a digital wallet or similaraccount that may be used to perform electronic transactions, such aspurchasing goods and/or services online.

Merchant system 14 may be one or more computer systems associated with amerchant. For example, merchant system 14 may be associated with anentity that provides goods and/or services (e.g., a retail store). Themerchant may include brick-and-mortar location(s) that a customer mayphysically visit and purchase goods and services. Such physicallocations may include computing devices (e.g., merchant system 14) thatperform financial service transactions with customers (e.g., POSterminal(s), kiosks, etc.). Additionally or alternatively, merchantsystem 14 may be associated with a merchant who provides electronicshopping mechanisms, such as a website or a similar online location thatconsumers may access using a computer through browser software, a mobileapplication, or similar software. Merchant system 14 may include aclient device, such as a laptop computer, desktop computer, smart phone,or tablet, that a customer may operate to accesses the electronicshopping mechanism.

Network 16 may be any type of network that facilitates communicationsand data transfer between components of transaction system 10, such as,for example, financial service provider system 12 and merchant system14. Network 16 may include but is not limited to a Local Area Network(LAN), a Wide Area Network (WAN), such as the Internet, and may be asingle network or a combination of networks. Network 16 is not limitedto the above examples, and transaction system 10 may implement any typeof network that allows the entities (shown and not shown) of transactionsystem 10 to exchange data and information.

Transaction system 10 may be configured to conduct a transactionassociated with the use of a transaction card 20. In one example,financial service provider system 12 may provide transaction card 20 toa customer for use in conducting transactions associated with afinancial service account held by the customer. In an example of onesuch transaction, the customer may use transaction card 20 at a merchantlocation to make a purchase. During the course of the purchase,information may be transferred from transaction card 20 to merchantsystem 14 (e.g., a point of sale device). Merchant system 14 maycommunicate with financial service provider system 12 via network 16 tocomplete the transaction. For example, merchant system 14 may receiveaccount information from transaction card 20. Merchant system 14 maytransmit the account information and a purchase amount, among othertransaction information, to financial service provider system 12.Financial service provider system 12 may settle the transaction bytransferring funds from the customer's financial service account to afinancial service account associated with the merchant.

For example, in some embodiments, transaction card 20 may include a datastorage component 24 disposed in a card frame 22. As used herein, a“data storage component” may be or include one or more devicesconfigured to receive, store, process, provide, transfer, send, delete,and/or generate data or other information. For example, data storagecomponent 24 may include a microchip (e.g., EMV chip), a communicationdevice (e.g., Near Field Communication (NFC) antenna, radiofrequencyidentification (RFID) device, Bluetooth® device, WiFi device), amagnetic strip, a barcode, a Quick Response (QR) code, and/or otherdevices. Data storage device 24 may be configured to store informationin a computer-readable format. For example, data storage device may beconfigured to store information in a format that can be read by merchantsystem 14, transmitted over network 16, and read or processed byfinancial service provider system 12.

While transaction system 10 and transaction card 20 are depicted anddescribed in relation to transactions that involve customers, merchants,and financial service providers, it should be understood that theseentities are used only as an example to illustrate one environment inwhich transaction card 20 may be used. It should be understood thattransaction card 20 is not limited to financial products and may be anyphysical card product that is configured to receive, store, and/ortransmit information. For example, transaction card 20 may be anidentification card configured to provide information for identifyingthe holder of the card (e.g., driver's license).

Referring to FIG. 2, in an exemplary embodiment, transaction card 20 mayinclude card frame 22 having an inlay component (“inlay”) 26 and ahousing component (“housing”) 28. Inlay 26 may be visible from a firstside 30 of transaction card 20, and housing 28 may be visible from asecond side 32 of transaction card 20 opposite first side 30. Inlay 26and housing 28 may be separate components that are connectable to formcard frame 22. That is, housing and inlay components 26 and 28 may benon-unitary (i.e., formed initially as two distinct components).

Inlay 26 may have a first inlay surface 38 and a second inlay surface 40opposite first inlay surface 38. First inlay surface 38 may be visiblefrom first side 30 and, as described below, may include visibleinformation (e.g., personal information). Housing 28 may include a firsthousing surface 42 and a second housing surface 44 opposite firsthousing surface 42. Second housing surface 44 may be visible from secondside 32 of card 20 and, as described below, may also or alternativelyinclude visible information. Inlay 26 and housing 28 may be configuredto be joined or connected via second inlay surface 40 and first housingsurface 42 using various techniques. For example, in some embodiments,inlay 26 and housing 28 may be discrete layers that are stacked orabutted and joined by a suitable technique or mechanism, such as (butnot limited to) adhesive materials, fasteners, interconnecting features(e.g., snap-fit features), interference fit, and/or combinationsthereof. Other joining techniques or mechanisms may be used.

As will be described in further detail below, inlay 26 may be a topoutward-facing component of card 20. In some embodiments, inlay 26 maybe partially set into housing 28. In other embodiments, inlay 26 not beset into housing 28 but may otherwise be affixed thereto. Inlay 26 mayinclude a fabric material, which may be visible from first side 30 orsecond side 32 of card 20. Methods/processes of forming inlay 26 will bediscussed in further detail below.

Housing 28 may be a bottom outward-facing component of card 20. Housing28 may be configured to house or contain other components of card 20.Housing 28 may include a cavity 36 that partially defines a space (notdepicted in FIG. 2) (i.e., a void space) within card 20 when housing andinlay components 26 and 28 are assembled (space is shown as 34 in FIGS.5C and 6C). In some embodiments, data storage component 24 may bedisposed within cavity 36 to house and/or protect data storage component24 from the elements, from wear-and-tear, and/or from tampering. Forexample, in some embodiments, cavity 36 may be configured (e.g., sized,shaped, etc.) to at least partially contain one or more of a microchip48 (e.g., an EMV chip), a communication device 50 (e.g., an NFC or RFIDdevice), and/or a magnetic strip (not shown). In other embodiments,cavity 36 may be configured to at least partially contain other oradditional types of data storage components and/or other card componentsand is not limited to those mentioned above.

Housing 28 may be formed of multiple separate components or as a unitarystructure. For example, housing 28 may be formed using molding process,such as an injection molding, compression molding, or other type ofmolding process. Housing 28 may be formed of, for example, polycarbonate(PC), polyvinyl chloride (PVC), or a resin mixture configured to impartadditional or desired properties on housing 28. For example, housing 28may be formed of a resin mixture comprising one or more of athermoplastic elastomer (TPE), polybutylene terephthalate (PBT), anacetal homopolymer, and/or other materials. In some embodiments, the TPEand/or other materials may be selected to provide card 20 with a“soft-touch feel” (i.e., a haptic sensation that occurs when a persontouches something that, for example, feels soft, smooth, and/or satiny).In some embodiments, the resin mixture may include a polyesterelastomer, a block copolymer, a thermoplastic olefin, an elastomericalloy, a thermoplastic polyurethane, a thermoplastic copolyester, or athermoplastic polyamide. In some embodiments, housing 28 may benon-opaque (e.g., translucent, transparent, clear, etc.) aftermanufacturing is complete (e.g., after setting).

Interior features of housing 28 may be formed during the formation ofhousing 28 (e.g., during injection molding, compression molding, etc.)or during a subsequent manufacturing process. For example, interiorfeatures of housing 28, such as cavity 36, may be formed using a millingprocess (e.g., computer numeric control (CNC) or manual milling), alaser-cutting process, a sanding or grinding process, or a materialdeposition process (e.g., 3-D printing).

Card 20 may be configured to permit, enable, or enhance datatransmission functions of data storage device 24. For example, in someembodiments, an aperture 52 may be provided on or in inlay 28 to permit,enable, and/or enhance transmission functions of data storage component24. Aperture 52 may be configured to allow data storage component 24 totransmit information through physical contact, optical recognition,radiofrequency communication, or other mechanisms. In other embodiments,aperture 52 may also or alternatively be provided on or in housing 28.Aperture 52 may be formed using a milling process, laser-cuttingprocess, stamping process, or another suitable process.

As used herein, the term “forming,” when used to describe methods,processes, or steps of forming components or features of transactioncards, may encompass acts of constructing components from constituent orstock materials. The term “forming” may also encompass acts of“providing” components that have already been constructed fromconstituent or stock materials.

FIG. 3A shows a front view of card 20 from first side 30. As shown,inlay 26 may include visible information 54. Visible information 54 mayinclude, for example, personal information, such as information that isassociated with a card, a user of the card, or information relating toan account associated with the card or card user. In some embodiments,visible information 54 may include “transaction information,” such asfinancial information (e.g., card numbers, account numbers, expirationdates etc.), individual-identifying information (e.g., name, address,signature, etc.), bank information, and/or transaction networkinformation, logos, designs, graphics, and/or other information.

Visible information 54 may be disposed on first inlay surface 38 toenable information 54 to be visible from first side 30 of card 20. Insome embodiments, visible information 54 may be formed into first inlaysurface 38. That is, for example, visible information 54 may be stamped(i.e., through the formation of one or more mechanical indents),printed, etched, milled, laser-cut, embossed, embroidered, stitched,woven, etc., into or onto first inlay surface 38 (i.e., into or onto thefabric material of first inlay surface 38). In other embodiments,visible information 54 may be disposed on second housing surface 44 in asimilar manner.

In some embodiments, an aperture 52 may be disposed on first inlaysurface 38 and configured to provide access to or enable functionalityof a data storage component 24 (e.g., an EMV chip).

FIG. 3B shows a rear view of card 20 from second side 32. Second housingsurface 44 may be visible from second side 32. In some embodiments,visible information 54 may be disposed on second housing surface 44instead of or in addition to first inlay surface 38. Information 54visible from second side 32 may include any information described abovewith respect to information 54 visible from first side 30. Other oradditional information may also or alternatively be included.

In some embodiments, as shown in FIG. 3B, data storage component 24 maybe visible or otherwise accessible from second side 32. For example, insome embodiments, a magnetic strip 56 may be disposed on or accessiblefrom (i.e., readable from) second housing surface 44. In otherembodiments, an aperture (not shown) may be disposed on second housingsurface 44 and configured to provide access to or enable functionalityof a data storage component. In other embodiments, one or more datastorage components may be disposed within card 20 (e.g., in cavity 36 ofhousing 28) and configured to perform data transmission functionsthrough the material of housing 28 and/or inlay 26 without an aperture.

FIGS. 4A-4C show an exemplary embodiment of card 20 without a microchipor internal data storage component. FIG. 4A shows a front view of card20 from first side 30. As shown, first inlay surface 38 may not includean aperture. A data storage component 24, such as a magnetic strip 56,may be disposed on second housing surface 44 and visible from secondside 32 of card 20, as shown in FIG. 4B. FIG. 4C depicts across-sectional view of card 20 of FIGS. 4A and 4B along line 4C-4C. Asshown in FIG. 4C, inlay 26 and housing 28 may be joined via second inlaysurface 40 and first housing surface 42. First inlay surface 38 may faceoutward (with respect to card 20) and away from first and second housingsurfaces 42, 44. That is, first inlay surface 38 may face and be visiblefrom first side 30 of card 20. Second inlay surface 40 may face inward(with respect to card 20) and toward first and second housing surfaces42, 44. First housing surface 42 may face inward (with respect to card20) and toward first and second inlay surfaces 38, 40. Second housingsurface 44 may face outward (with respect to card 20) and away fromfirst and second inlay surfaces 38, 40. That is, second housing surface44 may face and be visible from second side 32 of card 20.

FIGS. 5A-5C show an exemplary embodiment of card 20 having a microchip48 as a first data storage component 24. FIG. 5A shows a front view ofcard 20 from first side 30. As shown, first inlay surface 38 may includeaperture 52. Microchip 48 may be accessible (i.e., able to participatein data transfer) via aperture 52. As shown in FIG. 5B, second datastorage component 24, such as a magnetic strip 56 (shown in dashed linesas an optional component), may be disposed on second housing surface 44and visible from second side 32 of card 20.

FIG. 5C depicts a cross-sectional view of card 20 of FIGS. 5A and 5Balong line 5C-5C. As shown in FIG. 5C, aperture 52 may partially definespace 34. Space 34 may be a void space within card 20 or its components(e.g., within one or more of inlay 26 and housing 28). Space 34 may beconfigured to house or contain microchip 48. In the embodiment of FIG.5C, space 34 may extend from first inlay surface to below first housingsurface 42, but not to second housing surface 44. That is, space 34 mayextend through inlay 26 and partially through housing 28. In otherembodiments, space 34 may extend fully or only partially through inlay26, but not into housing 28. In other embodiments, space 34 may extendfrom an aperture in second housing surface 44 into housing 28 towardfirst inlay surface 42 (e.g., partially or fully through housing 28) andmay extend partially into inlay 26 (i.e., through second inlay surface40 but not first inlay surface 38).

As also shown in FIG. 5C, inlay 26 and housing 28 may be joined viasecond inlay surface 40 and first housing surface 42. First inlaysurface 38 may face outward (with respect to card 20) and away fromfirst and second housing surfaces 42, 44. That is, first inlay surface38 may face and be visible from first side 30 of card 20. Second inlaysurface 40 may face inward (with respect to card 20) and toward firstand second housing surfaces 42, 44. First housing surface 42 may faceinward (with respect to card 20) and toward first and second inlaysurfaces 38, 40. Second housing surface 44 may face outward (withrespect to card 20) and away from first and second inlay surfaces 38,40. That is, second housing surface 44 may face and be visible fromsecond side 32 of card 20.

FIGS. 6A-6C show an exemplary embodiment of card 20 having acommunication device 50 as a first data storage component 24. FIG. 6Ashows a front view of card 20 from first side 30. As shown, first inlaysurface 38 may include a microchip 48 (shown in dashed lines as anoptional component), accessible through aperture 52 (also shown indashed lines as an optional component), as a second, optional, datastorage component 24. As shown in FIG. 6B, third optional data storagecomponent 24, such as a magnetic strip 56 (shown in dashed lines as anoptional component), may be disposed on second housing surface 44 andvisible from second side 32 of card 20.

FIG. 6C depicts a cross-sectional view of card 20 of FIGS. 6A and 6Balong line 6C-6C. As shown in FIG. 6C, inlay 26 and housing 28 may beconfigured to partially define space 34 when joined. For example, secondinlay surface 40 and first housing surface 42 may partially define space34. Space 34 may be a void space within card 20 or its components (e.g.,inlay 26 and/or housing 28 may include cavities or recesses thatpartially define space 34). Space 34 may be configured to house orcontain communication device 50. In other embodiments, space 34 may alsoor alternatively be configured to house or contain other components ofcard 20, such as interconnecting features (e.g., for joining inlay 26and housing 28), electronics (e.g., data storage or transmissioncomponents, data processing components, lighting, power generation orstorage components, circuitry components, etc.), and/or othercomponents.

As also shown in FIG. 6C, inlay 26 and housing 28 may be joined viasecond inlay surface 40 and first housing surface 42. First inlaysurface 38 may face outward (with respect to card 20) and away fromfirst and second housing surfaces 42, 44. That is, first inlay surface38 may face and be visible from first side 30 of card 20. Second inlaysurface 40 may face inward (with respect to card 20) and toward firstand second housing surfaces 42, 44. First housing surface 42 may faceinward (with respect to card 20) and toward first and second inlaysurfaces 38, 40. Second housing surface 44 may face outward (withrespect to card 20) and away from first and second inlay surfaces 38,40. That is, second housing surface 44 may face and be visible fromsecond side 32 of card 20.

FIG. 7 shows an exemplary inlay component 26 comprising a fabricmaterial. The term “fabric” as used herein refers to a materialconstructed using natural or synthetic fibers. The fabric may beconstructed using, but is not limited to, a weaving process, knittingprocess, or nonwoven process. The term “woven” as used herein refers toany fabric material constructed through the interlacing of vertical andhorizontal yarns. The term “knit” as used herein refers to any fabricmaterial constructed by rows of interlocking loops. The term “yarn” asused herein refers to a continuous strand of fibers, formed into athread, for use in weaving or knitting processes.

Nonwoven processes may include, but are not limited to, a staplingprocess (spinning, cutting, and laying a nonwoven fabric), amelt-blowing process, a spunlaid process (spinning and then directlydispersing a nonwoven fabric), a flashspin process, or the like.

As shown in FIG. 7, inlay component 26 may be a unitary structurecomprising first inlay surface 38 and second inlay surface 40. As aunitary structure, inlay 26 may be formed of a fabric material havingdesired mechanical properties. That is, the fabric material of inlay 26may be chosen to achieve desired stiffness, strength, and/or othermeasures of durability of the inlay 26 or the card 20. In order toachieve these desired characteristics, parameters of the fabric materialof inlay 26 may be varied. For example, the fabric material of inlay 26may be woven, knit, or nonwoven, may be constructed with differentweaving patterns, may use different yarn weights, may contain differentfabric finishes or coatings, fiber compositions including natural and/orsynthetic fibers, and may contain varying thread counts.

In some embodiments, the fabric material of inlay 26 may be a wovenfabric constructed using a specific weaving pattern. For example, thefabric material of inlay 26 may be constructed using, but is not limitedto, any of the following weaving patterns: plain (or alternating),basket, satin, sateen, twill, ripstop, or jacquard. By constructing thefabric material of inlay 26 using different weaving patterns, the fabricmaterial may have different mechanical properties. For example, an inlay26 constructed using a plain weave may provide additional fabricstability. In some embodiments, an inlay 26 constructed using a satinweave may produce a fabric with increased flexibility. In otherembodiments, an inlay 26 constructed using a ripstop weave with acrosshatch pattern containing reinforcement threads may be moreresistant to ripping or tearing.

In some embodiments, the type of weaving pattern used to construct thefabric material of inlay 26 may enhance other desired characteristicsfor the fabric material, such as water, stain, or abrasion resistance.For example, in some embodiments, additional abrasion resistance may begained where the weaving pattern used to construct the fabric materialof inlay 26 includes longer floats in the weaving pattern. In someembodiments, the density of the weaving pattern (i.e., the number ofthreads in a given amount of space) used to construct the fabricmaterial of inlay 26 may create a fabric material with limited or noporosity in order to enhance water and stain resistance.

In some embodiments, the fabric material of inlay 26 may be constructedusing yarns of a specific weight. For example, in some embodiments, aninlay 26 constructed using a fabric with higher weight will produce asturdier fabric. In some embodiments, the fabric material of inlay 26may contain a specific thread count to obtain desired characteristics.The thread count may be calculated by counting the total number of warpends (along the length) and weft ends (along the width) in two adjacentedges of a one-inch square of the fabric. For example, in someembodiments, a high thread count fabric may be used to construct thefabric material of inlay 26 in order to obtain a more durable fabric.

In general, as materials are thinned (such as for use in a transactioncard having an overall thickness of about 30 thousandths of an inch),flexibility increases. Thus, an inlay having a unitary structure andcomprising a fabric material, as in the example of FIG. 7, may comprisea single layer of fabric having desired mechanical properties. Forexample, in some embodiments, fabrics resulting in a stiffer (i.e., morerigid or sturdy) inlay may include aramid or para-aramid fabrics, suchas poly-paraphenylene terephthalamide (e.g., Kevlar®). Suitable fabricsmay include nonwoven fabrics, i.e., sheets of fibers that arechemically, thermally, or mechanically bonded. Nonwoven fabrics mayinclude, for example, fibers of carbon, glass, aramid, polyester,thermoplastic, or mixtures thereof.

Fabrics for inlay 26 may also be chosen based on desired aestheticand/or tactile properties. That is, in addition to meeting certainmechanical requirements, selected fabrics may have a desired look orfeel. For example, nonwoven fabrics having a desired fiber matrixpattern or design may be used. In other embodiments, woven or knitfabrics having desired mechanical and aesthetic/tactile properties maybe used. For example, sturdy woven fabrics, such as canvas, denim, orother woven cotton fabrics. By way of further example, the woven cottonfabric may be denim constructed with a 3:1 twill weave, 2:1 twill weave,or a plain weave. In some embodiments, other weaving patterns used toconstruct inlay 26 may enhance the appearance, touch, and feel of firstinlay surface 38. In other embodiments, a high thread-countcotton-polyester blend fabric may be used. In yet other embodiments,synthetic fibers (e.g., polyester, or para-aramids, such as Kevlar®) maybe used.

In other embodiments, for example, the embodiment shown in FIG. 8, inlay26 may include a fabric layer 60 supported by a backer layer 62 toenhance mechanical performance of inlay 26 or card 20. For example,backer layer 62 may be joined with fabric layer 60 to increase rigidity,strength, and/or other mechanical properties, and to reduce warping orrippling when inlay 26 and housing 28 (depicted in FIGS. 2-6C) arejoined. As shown, fabric layer 60 may have a first fabric surface 64opposite a second fabric surface 66. Backer layer 62 may have a firstbacker surface 68 opposite a second backer surface 70. When a multilayerinlay (such as inlay 26 of FIG. 8) is assembled, first fabric surface 64and second backer surface 70 may correspond to first inlay surface 38and second inlay surface 40 (depicted in FIGS. 2-6C), respectively.Fabric layer 60 and backer layer 62 may be joined using an adhesivelayer 72 or other suitable joining mechanism (e.g., lamination,fastening, interconnecting features, etc.). In other embodiments, backerlayer 62 may be formed integrally with fabric layer 60, e.g., by formingbacker layer 62 via hot melt directly on fabric layer 60. FIG. 8 is apartially cut-away cross-sectional view of an exemplary embodiment ofinlay 26 showing fabric layer 60 joined to backer layer 62 by adhesivelayer 72.

Including backer layer 62 with fabric layer 60 may allow fabric layer 60to be thinner while also enabling inlay 26 to achieve desired mechanicalproperties. Thinner or less rigid fabric materials having desirablevisual, aesthetic, and/or tactile properties may be joined with backerlayer to provide inlay 26 with the desired visual, aesthetic, and/ortactile properties without rendering inlay 26 unacceptably flexible ordelicate. In this way, fabrics that may be more visually appealing butless rigid may be used as fabric layer 60 in inlay 26.

Backer layer 62 may be formed of a material more rigid or sturdy thanfabric layer 60. For example, backer layer 62 may be formed of wood,wood composite (e.g., medium-density fiberboard), metal, plastic (e.g.,acrylic, polycarbonate, polyethylene terephthalate, thermoplastics,etc.), and/or other materials or combinations thereof. In someembodiments, backer layer 62 may comprise nonwoven fabric comprisingfibers of, for example, carbon, glass, aramid, polyester, thermoplastic,poly-paraphenylene terephthalamide, or mixtures thereof.

As discussed, the fabric material for inlay 26 may be chosen based on anumber of criteria, including desired visual, aesthetic, and/or tactilecharacteristics. Some fabric materials have desirable visual, aesthetic,and/or tactile characteristics in their natural state. That is, somefabrics have a desirable look or feel that can be lost if covered orcoated with other materials. To preserve the natural look or feel of afabric material, the fabric material of inlay 26 may, in someembodiments, be left in a natural state without coatings. In otherembodiments, as shown in FIG. 9, inlay 26 (or just fabric layer 60) maybe coated with a coating material 74 to provide additional benefits.

For example, as shown in FIG. 9, coating material 74 may be applied tofabric layer 60 of multi-layer inlay 26. In other embodiments, coatingmaterial 74 may be applied to first inlay surface 38 when inlay 26comprises a unitary layer of fabric material (i.e., when inlay 26 doesnot include backer layer 62). Coating material 74 may be configured tocause inlay 26 to exhibit properties of being, for example, hydrophobic,oleophobic (i.e., stain resistant), laser-reactive, more durable, etc.

For example, coating material 74 may be a hydrophobic coating materialconfigured to provide water-resistant or water-repellant functionalityto inlay 26. Hydrophobic coating materials may include, for example,fluoropolymer-based coatings, silicone-based coatings, fluorochemicalcompounds, silastic or silicone elastomer coatings (e.g., acrylics,vinyls, polyurethanes and the like), rubber, polyvinyl chloride, andwax. Other types of water-resistant, water-repellant, and/or waterproofmaterials may be used. In other embodiments, coating material 74 mayalso or alternatively be oleophobic and stain-resistant. In someembodiments, coating material 74 may be applied using a chemical vapordeposition (CVD) process, allowing coating material 74 to be relativelyvery thin to minimize the effects of coating 74 on the fabric material'snatural aesthetic/tactile properties. In other embodiments, coatingmaterial 74 may be sprayed, brushed, or otherwise applied to inlay 26.In some embodiments, inlay 26, fabric layer 60, and/or other componentsof card 20 may be dipped (separately or together) in coating material74.

In some embodiments, coating material 74 may comprise a laser-reactivematerial to enable the underlying material (e.g., fabric) to be markedby a laser. That is, some fabric materials which may have desirableaesthetic and/or tactile properties may not react to laser light in away that allows the fabric to be properly marked, etched, or engraved.Such fabrics may be coated with a laser-reactive material to providelaser-reactive functionality to the fabric. Laser-reactive materials mayinclude materials configured to absorb energy from laser light to changecolor or shade. Non-limiting examples of laser-reactive materials mayinclude antimony-doped tin oxide, metal oxide-coated micas includingmetal-doped metal oxide-coated micas, clays, talc, kaolins, chalks,aluminas, phyllosilicates, carbon black, salts of antimony, copper, andother metals such as antimony (III) oxide, metallic pigments such asaluminum flake pigments, and pearlescent pigments. Laser-reactivematerials may also or alternatively include polymers, including, but notlimited to, acrylic polymers, polyurethanes, polyethers, cellulosics,epoxy polymers and oligomers, polyesters, alkyds, and combinationsthereof. Commercially available laser-reactive materials may be used tocoat components of inlay 26.

FIG. 10 shows an exemplary method/process 1000 of forming a transactioncard 20 consistent with disclosed embodiments. The process 1000 mayinclude forming a housing component having a first housing surfaceopposite a second housing surface (Step 1010). FIG. 11A illustrates anexample of step 1010 in which inlay component 26 and housing component28 may be formed separately (i.e., as distinct components via separate,respective processes).

Housing 28 of FIGS. 2-6C may be formed during step 1010, for example, bya molding process (e.g., injection molding, compression molding, etc.),milling process, stamping process, or combinations thereof. In someembodiments, features of housing 28, such as first housing surface 42,second housing surface 44, and cavity 36 (as depicted in FIGS. 2, 5C,and 6C) may be formed during a process of injection molding housing 28.In other embodiments, a portion of housing 28 may be formed (e.g., by amolding or sheet forming process), and housing features may be formed orrefined during a subsequent manufacturing process. For example, firstand second housing surfaces 42, 44 and/or cavity 36 may be formed byforming or providing a portion of housing 28 and removing material togenerate housing features (e.g., via a milling, laser cutting, or otherprocess). Housing 28 may include first housing surface 42 and secondhousing surface 44 (as depicted in FIGS. 2, 4C, 5C, and 6C).

Process 1000 may also include forming an inlay component having a firstinlay surface opposite a second inlay surface, wherein the first inlaysurface comprises a fabric material (Step 1020). Inlay 26 of FIGS. 2-9may be formed during step 1020. For example, forming inlay 26 mayinclude weaving, knitting, or binding fibers of desired material, or bycutting or otherwise separating a portion of fabric material from a rollor sheet of stock material. In some embodiments, inlay 26 may be aunitary component (i.e., may be a single component or layer). Inlay 26may include first inlay surface 38 and second inlay surface 4, as shownin FIG. 11A. In other embodiments, forming inlay 26 may include additionsteps or sub-steps, as discussed below.

Process 1000 may also include joining the housing component and theinlay component via the second inlay surface and the first housingsurface (Step 1030). With reference to FIGS. 11A-11C, inlay 26 andhousing 28 may be brought together during step 1030 such that secondinlay surface 40 faces and/or contacts first housing surface 42. Firstinlay surface 38 and second housing surface 44 may face away from eachother (i.e., in opposite directions), and may each face away from eachof second inlay surface 40 and first housing surface 42. In someembodiments, inlay 26 may be inserted (e.g., partially or fully) intocavity 36 of housing 28. Inlay 26 and housing 28 may be joined, forexample, using an adhesive material, interconnecting features,fasteners, and/or another types of joining technique or mechanism. Asshown in FIG. 11B, for example, adhesive layer 72 may be disposedbetween and contact each of second inlay surface 40 and first housingsurface 42 for joining inlay 26 to housing 28. In some embodiments,inlay 26 may be inserted into cavity 36 of housing 28 such that firstinlay surface 38 rests below a top surface of housing 28. As shown inFIG. 11C, for example, inlay 26 may be placed in housing 28 such that atop surface 58 of housing 28 extends beyond (or above) first inlaysurface 38 in order to further protect inlay 26 and the edges of inlay26 in particular from wear during use of transaction card 20. Forexample, first inlay surface 38 may be protected from scratching,tearing, or other wearing when card 20 is used (i.e., swiped or insertedinto a card reader), dropped, slid across a surface (such as a counter,desk, or table), etc. In this way, the service life of card 20 may beincreased.

As described above, inlay component 26 may, in some embodiments, beformed as a unitary structure. In other embodiments, inlay 26 maycomprise a plurality of components or subcomponents. FIG. 12 shows anexemplary process/method of forming an inlay component 26 havingmultiple subcomponents consistent with disclosed embodiments. Process1200 may include forming a backer layer configured to support the fabricmaterial of the first inlay surface (Step 1210). FIG. 13A illustrates anexample of step 1210 in which a fabric layer 60 and a backer layer 62may be formed separately (i.e., as distinct components via separate,respective processes).

Forming fabric layer 60 may include weaving, knitting, or binding fibersof desired material, or by cutting or otherwise separating a portion offabric material from a roll or sheet of stock material. Fabric layer 60may be formed to have a first fabric surface 64 opposite a second fabricsurface 66. Correspondingly, backer layer 62 may include a first backersurface 68 opposite a second backer surface 70. Backer layer 62 may beformed of a material more rigid or sturdy than fabric layer 60. Forexample, backer layer 62 may be formed of wood, wood composite (e.g.,medium-density fiberboard), metal, plastic (e.g., acrylic,polycarbonate, polyethylene terephthalate, thermoplastics, etc.), and/orother materials or combinations thereof. In some embodiments, backerlayer 62 may also or alternatively comprise nonwoven fabric comprisingfibers of, for example, carbon, glass, aramid, polyester, thermoplastic,poly-paraphenylene terephthalamide, or mixtures thereof. Backer layer 62may support fabric layer 60 such that first fabric surface 64corresponds to first inlay surface 38 and second backer layer 70corresponds to second inlay layer 40 (as depicted in FIGS. 2, 4C, 5C,and 6C).

Process 1200 may also include joining the fabric layer and the backerlayer via the second fabric surface and the first backer surface (Step1220). With reference to FIGS. 13A and 13B, fabric layer 60 and backerlayer 62 may be brought together during step 1220 such that secondfabric surface 66 faces and/or contacts first backer surface 68. Firstfabric surface 64 and second backer surface 70 may face away from eachother (i.e., in opposite directions), and may each face away from eachof second fabric surface 66 and first backer surface 68. In someembodiments, fabric surface 60 and backer surface 62 may be joined, forexample, using an adhesive material, interconnecting features,fasteners, and/or another types of joining technique or mechanism. Asshown in FIG. 13B, for example, adhesive layer 72 may be disposedbetween and in contact with each of second fabric surface 66 and firstbacker surface 68 for joining fabric surface 60 to backer surface 62.

Process 1200 may also include disposing visible information on thefabric material of first inlay surface (Step 1230). Visible informationmay include, for example, personal information, such as information thatis associated with a card, a user of the card, or information relatingto an account associated with the card or card user. In someembodiments, visible information may include “transaction information,”such as financial information (e.g., card numbers, account numbers,expiration dates etc.), individual-identifying information (e.g., name,address, signature, etc.), bank information, and/or transaction networkinformation, logos, designs, graphics, and/or other information. Visibleinformation may be disposed on first inlay surface 38 (e.g., on firstfabric surface 64). In some embodiments, visible information may beformed into first inlay surface 38. That is, for example, visibleinformation may be stamped, printed, etched, milled, laser-cut,embossed, embroidered, stitched, woven, etc., into or onto first inlaysurface 38 (i.e., into or onto the fabric material of first inlaysurface 38). In other embodiments, visible information may be disposedon second housing surface 44 in a similar manner.

Process 1200 may further include coating the fabric material of thefirst inlay surface with a coating material (Step 1240). For example, asshown in FIG. 13C, coating material 74 may be disposed on fabric layer60 to, for example, protect fabric layer 60 from the elements. In suchan example, coating material 74 may be applied to fabric layer 60 toprovide water-repellant, water-resistant, oleophobic (i.e., stainresistant), and/or laser reactive properties to inlay 26. For example,coating material 74 may be a hydrophobic coating material configured toprovide water-resistant or water-repellant functionality to inlay 26.Hydrophobic coating materials may include, for example,fluoropolymer-based coatings, silicone-based coatings, fluorochemicalcompounds, silastic or silicone elastomer coatings (e.g., acrylics,vinyls, polyurethanes and the like), rubber, polyvinyl chloride, andwax. Other types of water-resistant, water-repellant, and/or waterproofmaterials may be used. In other embodiments, coating material 74 mayalso or alternatively be oleophobic and stain-resistant. In someembodiments, coating material 74 may be applied using a chemical vapordeposition (CVD) process, allowing coating material 74 to be relativelyvery thin to minimize the effects of coating 74 on the fabric material'snatural visual, aesthetic, and/or tactile properties. In otherembodiments, coating material 74 may be sprayed, brushed, or otherwiseapplied to inlay 26. In some embodiments, inlay 26, fabric layer 60,and/or other components of card 20 may be dipped (separately ortogether) in coating material 74.

In some embodiments, coating material 74 may comprise a laser-reactivematerial to enable the underlying material (e.g., fabric) to be markedby a laser (e.g., for providing visible information on fabric layer 60).That is, some fabric materials which may have desirable aesthetic and/ortactile properties may not react to laser light in a way that allows thefabric to be properly marked, etched, or engraved. Such fabrics may becoated with a laser-reactive material to provide laser-reactivefunctionality to the fabric. Laser-reactive materials may includematerials configured to absorb energy from laser light to change coloror shade. Non-limiting examples of laser-reactive materials may includeantimony-doped tin oxide, metal oxide-coated micas including metal-dopedmetal oxide-coated micas, clays, talc, kaolins, chalks, aluminas,phyllosilicates, carbon black, salts of antimony, copper, and othermetals such as antimony (III) oxide, metallic pigments such as aluminumflake pigments, and pearlescent pigments. Laser-reactive materials mayalso or alternatively include polymers, including, but not limited to,acrylic polymers, polyurethanes, polyethers, cellulosics, epoxy polymersand oligomers, polyesters, alkyds, and/or combinations thereof.

In such embodiments, step 1240 may be performed, at least in part, priorto step 1230. For example, fabric layer 60 may be coated with coatingmaterial 74, and the visual information may then be disposed either oncoating material 74 (e.g., via laser or other method to which coatingmaterial 74 is reactive) or on fabric layer 60 by means of coatingmaterial 74 (e.g., by manipulating coating material 74 to only coat aportion of fabric layer 60 such that the visual information is visiblevia a visual or tactile difference between the portion of fabric layer60 that is coated and the portion that is not). By way of furtherexample, visual information may be disposed on second housing surface44, after which fabric layer 60 may be coated with coating material 74,after which additional visual information may be disposed either oncoating material 74 or on fabric layer 60 by means of coating material74.

While illustrative embodiments have been described herein, the scopeincludes any and all embodiments having equivalent elements,modifications, omissions, combinations (e.g., of aspects across variousembodiments), adaptations or alterations based on the presentdisclosure. The elements in the claims are to be interpreted broadlybased on the language employed in the claims and not limited to examplesdescribed in the present specification or during the prosecution of theapplication, which examples are to be construed as non-exclusive. It isintended, therefore, that the specification and examples be consideredas example only, with a true scope and spirit being indicated by thefollowing claims and their full scope of equivalents.

1-20. (canceled)
 21. A transaction card, comprising: a housing componenthaving a first housing surface opposite a second housing surface andforming a cavity defined by walls of the housing component; and an inlaycomponent having a first inlay surface opposite a second inlay surface,the inlay and housing being joined such that the inlay component isdisposed within the cavity, the first inlay surface comprising; a fabricmaterial; and a backer layer configured to support the fabric materialof the first inlay surface; wherein a space is defined by the walls ofthe housing component, the first housing surface, and the second inlaysurface.
 22. The transaction card of claim 21, further comprising afirst data storage component disposed within the space.
 23. Thetransaction card of claim 22, wherein the inlay component furthercomprises an aperture providing physical contact with a second datastorage component.
 24. The transaction card of claim 22, wherein theinlay component has an aperture providing physical contact with a seconddata storage component.
 25. The transaction card of claim 22, whereinthe housing component has an aperture providing physical contact with asecond data storage component.
 26. The transaction card of claim 22,wherein the first data storage comprises a communication deviceconfigured to transmit wireless data signals through at least one of theinlay component and the housing component.
 27. The transaction card ofclaim 24, further comprising a third data storage component disposed onthe second housing surface.
 28. The transaction card of claim 27,wherein at least one of the first data storage component, the seconddata storage component, and the third data storage component comprise atleast one of a Europay, Mastercard and Visa (EMV) chip, a magneticstrip, a near field communication antenna, a radiofrequencyidentification device, a Bluetooth device, or a WiFi device.
 29. Thetransaction card of claim 21, wherein the housing component and thesecond inlay surface are joined with an adhesive material.
 30. Thetransaction card of claim 21, wherein the housing component and theinlay component are laminated together.
 31. A transaction card,comprising: a housing component having a first housing surface oppositea second housing surface forming a cavity defined by walls of thehousing component; a fabric surface including visible informationthereon; a backer layer supporting the fabric surface and having greaterrigidity than the fabric surface, the backer layer having a backer layersurface opposite the fabric surface such that the fabric surface isvisible; a data storage component disposed within a space defined by thewalls of the housing component, the first housing surface, and thebacker layer surface.
 32. The transaction card of claim 31, furthercomprising a layer of adhesive disposed between the fabric surface andthe backer layer.
 33. The transaction card of claim 31, wherein thefabric surface and the backer layer are laminated together.
 34. Thetransaction card of claim 31, wherein the backer layer comprises atleast one of wood, wood composite, metal, or plastic.
 35. Thetransaction card of claim 31, further comprising a coating materialdisposed on the fabric surface.
 36. The transaction card of claim 35,wherein the coating material is hydrophobic.
 37. The transaction card ofclaim 35, wherein the coating material is oleophobic.
 38. Thetransaction card of claim 35, wherein the coating material islaser-reactive.
 39. The transaction card of claim 38, further comprisingvisible information disposed on the coating material using a laser. 40.A transaction card, comprising: a housing component having a firsthousing surface opposite a second housing surface and forming a cavitydefined by walls of the housing component; and an inlay component havinga first inlay surface opposite a second inlay surface, the inlay andhousing being joined such that the inlay component is disposed withinthe cavity, the first inlay surface comprising; a fabric material; and abacker layer configured to support the fabric material of the firstinlay surface; a communication device disposed within a space defined bythe walls of the housing component, the first housing surface, and thesecond inlay surface; a microchip accessible through an aperture locatedon the inlay component; and a magnetic strip disposed on the secondhousing surface.